Thermal shock test chamber is an efficient device used to administer a thermal shock test to parts and products. Thermal shock test chambers are fitted with a basket that moves a product being tested from different modified temperature zones. Users can easily observe a product as it is transferred between zones of different temperature via in-built viewing windows. There are different performance configurations for thermal shock test chambers to meet unique testing needs and it includes an 8825 Controller intuitive in nature.
The thermal shock tests chambers are used to subject a product sample to intense shocks via the quick and cyclic passage from an area of high temperature to an area of low temperature area, so as to identify defective components which are prone to infantile mortality (majorly in the field of electronics).
The product sample is placed in a movable basket that transports it from a cold region to a hot region and back for a given number of times. The chambers have 2 or more testing compartments. The movement of the product sample from one compartment to the other is done very quickly.
The purpose of these tests is to examine the behavior of the product when it goes through a thermal shock; in these situations, depending on the material, the sample may become cool or heated up in different parts with different speeds. If this corresponds to large contraction or increase in volume, the material could undergo huge mechanical stresses that could result in failure.
One needs to consider electronic boards used for aeronautic devices whereby reliability is a very essential requirement. During a severe thermal shock, faults could take place in the electronic circuits if the shock is higher than the maximum resistance the material could withstand. Other problems which could possibly occur in defective parts are the failure of welds or the breakage of pins if the materials used have different coefficient of thermal expansion.
It is important to use a thermal shock chamber to reveal possible defects in production process, products, their components etc. before the production begins, and all the required modifications to improve product performance.
Three configurations of the test chamber include the following:
A Thermal Shock Chamber of Vertical Orientation: It has two zones that are hot and cold and are independently controlled; one on top of the other. One product carrier transports between each zone, to subject the product to drastic temperature changes.
A thermal shock chamber with horizontal orientation: This has three independent zones placed next to each other: cold, ambient, and hot. The inclusion of the ambient zone permits for 3 zone tests, which is required for certain military standards.
A double duty thermal shock chamber includes a cold zone that is positioned between two hot zones, vertically aligned from top to bottom. Products being tested are positioned in one of 2 product carriers and transferred between zones which produce intense thermal stress.
Just think of the electronic plates used for aeronautical applications for which reliability is an absolutely essential prerequisite. Electronic circuit failures may occur during severe thermal shock if the shock is greater than the maximum strength of the material. Possible problems that may arise in defective parts are the breakage of the pins or the failure of welds if the materials used have different coefficients of thermal expansion.
The use of a Thermal Shock Chamber is essential to discover possible defects in the products, their components or production process and to operate, before production begins, all the modifications necessary to increase the performance of the product.
